HX-6

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® HX-6是专为半导体蚀刻(Etching)及沉积(Deposition)工序特别开发的超纯全氟产品。
NANOPURE® HX-6是专为最大限度解决苛刻的等离子环境下,因蚀刻率低,导致微粒产生的一系列问题而设计。不仅具有优异的热稳定性、超低的出气率(outgassing),还为产品提供出色的弹性恢复率(Excellent elastic recovery) 及机械特性。
NANOPURE® HX-6最高可在 325℃环境下使用。

Features & Benefit

  • Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas
  • Excellent reistance to dry process chemistry
  • Excellent thermal stability
  • Very low outgassing properties and metals content
  • Excellent elastic recovery and low compression set properties

Suggested Applications

  • Gas inlet/orifice seals
  • Chamber lid / Isolation valve seals

Typical Physical Properties

Color Dark Brown
Polymer Type Perfluoroelastomer
Hardness1), Shore A 74
Tensile Strength at Break2), MPa 12.4
Elongation at Break3), % 178
100% Modulus4), MPa 5.2
Compression Set5), %
70 hours @ 204℃ 8
70 hours @ 250℃ 12
70 hours @ 300℃ 19
70 hours @ 325℃ 34
Maximum Continuous Service,
Temperature, ℃
325

Compression Set Test* Results

Conditions : 300℃ @ 72hrs

Contents  Unit  HX-6 其他公司 NON-FILLER FFKM
Deflection  24.57 23.7 22.81 23.03
Before CSD  mm  3.5 3.46 3.42 3.43
After CSD  mm  3.33 3.31 2.99 3.01
Compression Set  19.77 18.29 55.13 53.16
Average C/S  %  19.03 54.15
Compression set test : AS568A-214 O-Ring @ ASTM D395 Method B

推荐使用工序

高等离子工序、 高蚀刻率工序、 随时可能有异物侵入



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