HP9600

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® HP9600是专为半导体工序特别开发的产品。
NANOPURE® HP9600是专为最大限度解决苛刻的等离子环境及机械性损伤下,因蚀刻率低,导致微粒产生的一系列问题而设计。
此外,凭借优异的弹性恢复率(Excellent elastic recovery)和出色的机械特性,延长了密封件的寿命,为工序提供较高的投入产出比,适用于“组合闸阀密封”。
NANOPURE® HP9600最高可在300℃环境下使用。

Features & Benefit

  • Outstanding plasma resistance in highly corrosive flurine environments with minimal sealdegradation
  • Excellent surface resistance for minimal particulation and sealing integrity
  • High purity for minimal contamination risk
  • Minimal compression set at elevated temperatures ensures seal integrity
  • Extended equipment uptime with added reliability in dry applications

Suggested Applications

  • Deposition (CVD, PECVD, HDPCVD, PEALD)
  • Plasma etch (fluorine species)
  • Bonded gate valves / slit valve door seals

Typical Physical Properties

Color Black
Polymer Type Perfluoroelastomer
Hardness1), Shore A 78
Tensile Strength at Break2), MPa 20.9
Elongation at Break3), % 185
100% Modulus4), MPa 6.8
Compression Set5), %
70 hours @ 204℃ 14
70 hours @ 250℃ 30
70 hours @ 300℃  
70 hours @ 325℃  
Maximum Continuous Service,
Temperature, ℃
300
  1. ASTM D1415 (ISO 48)
  2. ASTM D412 (ISO 37)
  3. ASTM D412 (ISO 37)
  4. ASTM D412 (ISO 37)
  5. ASTM D395 Method B ; (ISO 815)

推荐使用工序

随时可能有异物侵入、耐热及驱动优化工序



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