XUP

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® XUP是专为半导体工序使用而特别开发的超纯产品。
NANOPURE® XUP是专为最大限度解决苛刻的等离子环境下,因蚀刻率低,导致微粒产生的一系列问题而设计。
此外,凭借优异的弹性恢复率(Excellent elastic recovery)及机械特性,适用于所有固定部与驱动部。
NANOPURE® XUP最高可在300℃环境下使用。

Features & Benefit

  • High purity (Particle free)
  • Eliminated exposure surface of seal meterial to plasma
  • Excellent thermal stability
  • Low metallic impurities
  • Excellent elastic recovery and low compression set properties

Suggested Applications

  • All CVD applications
  • Dry etch equipment
  • Plasma ashing equipment
  • Bonded gate valves / slit valve door seals

Typical Physical Properties

Color Dark Auburn
Polymer Type Perfluoroelastomer
Hardness1), Shore A 75
Tensile Strength at Break2), MPa 14.0
Elongation at Break3), % 216
100% Modulus4), MPa 4.2
Compression Set5), %
70 hours @ 204℃ 12
70 hours @ 250℃ 38
70 hours @ 300℃  
70 hours @ 325℃  
Maximum Continuous Service,
Temperature, ℃
300
  1. ASTM D1415 (ISO 48)
  2. ASTM D412 (ISO 37)
  3. ASTM D412 (ISO 37)
  4. ASTM D412 (ISO 37)
  5. ASTM D395 Method B ; (ISO 815)

推荐使用工序

CL2, O2等干法蚀刻(Dry Etch)工序、高等离子工序、随时可能有异物侵入



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