HX-6

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® HX-6 is a specially developed ultrapure perfluorine product for semiconductor Etching and Deposition process.
NANOPURE® HX-6 is designed to minimize the particle outbreak problem that is caused by low etch rate in an especially severe plasma environment. Also, it provides superb heat stability, very low outgassing and superb compression restoration rate and mechanical properties.
NANOPURE® HX-6 is usable up to 325°C.

Features & Benefit

  • Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas
  • Excellent reistance to dry process chemistry
  • Excellent thermal stability
  • Very low outgassing properties and metals content
  • Excellent elastic recovery and low compression set properties

Suggested Applications

  • Gas inlet/orifice seals
  • Chamber lid / Isolation valve seals

Typical Physical Properties

Color Dark Brown
Polymer Type Perfluoroelastomer
Hardness1), Shore A 74
Tensile Strength at Break2), MPa 12.4
Elongation at Break3), % 178
100% Modulus4), MPa 5.2
Compression Set5), %
70 hours @ 204℃ 8
70 hours @ 250℃ 12
70 hours @ 300℃ 19
70 hours @ 325℃ 34
Maximum Continuous Service,
Temperature, ℃
325

Compression Set Test* Results

Conditions : 300℃ @ 72hrs

Contents  Unit  HX-6 Other companies NON-FILLER FFKM
Deflection  24.57 23.7 22.81 23.03
Before CSD  mm  3.5 3.46 3.42 3.43
After CSD  mm  3.33 3.31 2.99 3.01
Compression Set  19.77 18.29 55.13 53.16
Average C/S  %  19.03 54.15
Compression set test : AS568A-214 O-Ring @ ASTM D395 Method B

Recommended Use of process

High plasma process, High etch rate process, free from an alien substance



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