XUP

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® XUP is an ultrapure product specially developed for semiconductor processing.
NANOPURE® XUP is designed to minimize the particle outbreak problem that is caused by low etch rate in an especially severe plasma environment. In addition, with its superb compression restoration rate, NANOPURE® XUP is suitable for both the fixture and drive head.
NANOPURE® XUP is usable up to 300°C .

Features & Benefit

  • High purity (Particle free)
  • Eliminated exposure surface of seal meterial to plasma
  • Excellent thermal stability
  • Low metallic impurities
  • Excellent elastic recovery and low compression set properties

Suggested Applications

  • All CVD applications
  • Dry etch equipment
  • Plasma ashing equipment
  • Bonded gate valves / slit valve door seals

Typical Physical Properties

Color Dark Auburn
Polymer Type Perfluoroelastomer
Hardness1), Shore A 75
Tensile Strength at Break2), MPa 14.0
Elongation at Break3), % 216
100% Modulus4), MPa 4.2
Compression Set5), %
70 hours @ 204℃ 12
70 hours @ 250℃ 38
70 hours @ 300℃  
70 hours @ 325℃  
Maximum Continuous Service,
Temperature, ℃
300
  1. ASTM D1415 (ISO 48)
  2. ASTM D412 (ISO 37)
  3. ASTM D412 (ISO 37)
  4. ASTM D412 (ISO 37)
  5. ASTM D395 Method B ; (ISO 815)

Recommended Use of process

Dry Etch process f



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