I800W

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® 1800W is a product specially developed for semiconductor process.
NANOPURE® 1800W is designed to minimize particles formation caused by NF3 Plasma in high temperature. Especially, 1800W has low etch rate and superb mechanical strength in fluorine and oxygen plasma environment.
NANOPURE® 1800W is usable up to 300°C .

Features & Benefit

  • Excellent mechanical strength properties
  • Excellent resistance to ‘dry’ gas process environments
  • Very low weight loss in reactive plasmas
  • Excellent (low) compression set properties
  • Excellent elastic recovery properties

Suggested Applications

  • Chamber lid seals
  • Gas inlet seals
  • Quartz window seals
  • Other thermal applications
  • Other plasma applications

Typical Physical Properties

Color White
Polymer Type Perfluoroelastomer
Hardness1), Shore A 76
Tensile Strength at Break2), MPa 12.0
Elongation at Break3), % 250
100% Modulus4), MPa 5.0
Compression Set5), %
70 hours @ 204℃ 17
70 hours @ 250℃ 25
70 hours @ 300℃ 49
70 hours @ 325℃  
Maximum Continuous Service,
Temperature, ℃
320
  1. ASTM D1415 (ISO 48)
  2. ASTM D412 (ISO 37)
  3. ASTM D412 (ISO 37)
  4. ASTM D412 (ISO 37)
  5. ASTM D395 Method B ; (ISO 815)

Recommended Use of process

Plasma process that requires high heat-resistance



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