High temperature compensation in VITON group

For Semiconduct PECVD and HDPCVD Processes

NANOPURE® EAO-75 is a drastically improved product in thermal resistance and wear resistance compared to the existing FKM.
NANOPURE® EAO-75 is designed to minimize the particle outbreak problem that is caused by low etch rate and mechanical damage. In addition, with superb compression restoration rate and mechanical properties, NANOPURE® EAO-75 prolongs a seal’s lifespan and provides high process yield. NANOPURE® EAO-75 is usable up to 280°C.

Features & Benefit

  • Excellent abrasion resistance
  • Minimal contamination due to seal degradation or metallic ion content
  • Extends in-use seal life between preventive maintenance cycles
  • Excellent physical properties
  • Low compression set

Suggested Applications

  • Endpoint windows
  • Valve seals
  • Fitting seals
  • Windows seals
  • Lid seals
  • Gas inlet seals
  • Slit valve seals
  • Chamber seals

Typical Physical Properties

Color Black
Polymer Type Perfluoroelastomer
Hardness1), Shore A 75
Tensile Strength at Break2), MPa 16.4
Elongation at Break3), % 155
100% Modulus4), MPa 9.1
Compression Set5), %
70 hours @ 204℃ 11
70 hours @ 250℃  
70 hours @ 300℃  
70 hours @ 325℃  
Maximum Continuous Service,
Temperature, ℃
  1. ASTM D1415 (ISO 48)
  2. ASTM D412 (ISO 37)
  3. ASTM D412 (ISO 37)
  4. ASTM D412 (ISO 37)
  5. ASTM D395 Method B ; (ISO 815)

Recommended Use of process

Process that requires CVD and high heat resistance


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