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    Physical Properties

    FFKM is a perfluoroelastomer that contains more fluorine than general fluoroelastomer.
    FFKM is resistant to higher temperatures and various chemicals and can withstand long periods of time even in the presence of plasma. In particular, perfluoroelastomers of a specific grade can be used continuously at up to 327℃, and based on these characteristics, they are used in various industries that require sealing, such as semiconductors and petrochemicals.

    01 Molecular Structure

    Molecular Structure

    FFKM & FKM Physical Properties

    FFKM & FKM Physical Properties

    02 MNE Products

    MNE
    Products

    03Applications

    Field of Application

    Automotive

    Semiconductor

    Oil & Gas

    Chemical Processing
    Industry

    Detailed Comparison

    Contents Process Seal Temperature DuPontTM / Kalrez® GreeneTweedTM / Chemraz® MNETM NANOPURE®
    Plasma Processes HDP-CVD / PE-CVD 25 ~ 200℃ 9100 / 8085 XRZ 657 HX-8 XUP M208
    Etching 25 ~ 200℃
    Ashing / Stripping 25 ~ 250℃ HP9600 XUP HX-10
    Thermal Processes SA - CVD 25 ~ 250℃ 8085 XE38 I800W HP9600
    Metal-CVD, ALD, LP-CVD 25 ~ 300℃ 8900 / 9100 657 HX-5 HX-8
    Oxidation, Diffusion 150 ~ 300℃ 9800 / 8475 657 HX-5 875HT
    Lamp Anneal, RTP 150 ~ 300℃ 8475 E38 I800W
    Wet Processes Wafer Prep 25 ~ 125℃ 6375
    4079    		   I800W 4080
    Etching 25~180℃
    Photolithography 25~125℃
    Stripping 25~125℃ 6375
    Copper Plationg 25~100℃
    Contents Color Service
    Temp.,℃     		Hardness,
    Shore A    		 Tensile
    Stength, MPa    		 Elongation, % 100%
    Modulus, MPa    		 C/S 204℃ at 70hr
    (177℃ at 22hr), %
    Non Filler HX-10 275 69 19.5 184 3.1 16
    HX-8 310 74 11.0 250 3.9 16
    XUP 300 75 14.0 216 4.2 12
    M208 310 71 11.9 208 4.5 15
    With Filler HX-9 327 78 14.3 178 7.2 10
    HX-7 325 75 11.2 202 6.1 12
    875HT 320 75 10.0 220 4.2 12
    4080 280 78 17.7 140 11.4 20
    Copolymer 7575 220 75 15.1 210 5.3 28
    7870G 220 75 14.0 220 6.2 28
    Terpolymer EAO75S 260 74 21.6 230 5.4 16
    9020SP 260 70 18.2 290 2.1 20
    HPE
    (Tetrapolymer)    		 9023SP 250 73 22.5 226 4.7 17.9
    UTC-3 250 68 20.0 280 2.6 20
    UTC-4 220 68 17.1 323 2.2 23
    Pvmq 102FVMQ 200 70 10.0 300 4.0 15
    • FFKM – non Filler
    • FFKM – with Filler
    • FKM – Copolymer
    • FKM – Terpolymer
    • HPE – Tetrapolymer
    • FVMQ

    NANOPURE® XUP

    For Semiconductor Processes

    NANOPURE® XUP is an ultrapure water product specially developed for semiconductor processing.

    NANOPURE® XUP is designed to minimize problems caused by particle generation with a low etch rate, especially in harsh plasma environments. In addition, it is suitable for both fixed and driving parts due to its excellent permanent compression recovery rate and mechanical properties. NANOPURE® XUP can be used up to 300℃.

    Features & Benefit

    • High purity (Particle free)
    • Eliminated exposure surface of seal meterial to plasma
    • Excellent thermal stability
    • Low metallic impurities
    • Excellent elastic recovery and low compression set properties

    Suggested Applications

    • All CVD applications
    • Dry etch equipment
    • Plasma ashing equipment
    • Bonded gate valves / slit valve door seals

    Typical Physical Properties

    Color Dark Auburn
    Polymer Type Perfluoroelastomer
    Hardness1), Shore A 75
    Tensile Strength at Break2), Mpa 14.0
    Elongation at Break3), % 216
    100% Modulus4), Mpa 4.2
    Compression Set5), % -
    70 hours @ 204℃ 12
    70 hours @ 300℃ 38
    Maximum Application Temperature, ℃ 300

    1) ASTM D1415 (ISO 48), 2) ASTM D412 (ISO 37), 3) ASTM D412 (ISO 37), 4) ASTM D412 (ISO 37), 5) ASTM D395 Method B : (ISO 815)