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Leading technology and research determine the yield of semiconductor processing.
Overview
패킹용 고무O-Ring
패킹용 고무O-Ring
패킹용 고무O-Ring
02 Characteristics
It is assembled in the groove and comes into contact with the SLIDING SURFACE by compression, and has sealing power by repulsive elasticity.
The O-ring is compressed at the same time as assembly to automatically form a sealing force and has a long lifespan, especially when it is used for fixing.
03 applied role
The sealing material installed in the semiconductor production equipment is a precise part and is typically made by casting with an elastic material or processing with plastic, and is designed to form a barrier in the passage of fluid or gas in the equipment or parts used. BARRIER or SEALING ACTION is achieved by the characteristics of the SEALING material that closely adheres to the SEALING surface. It should not stick to the sealing surface and maintain its original performance for a certain period of time when subjected to periodic movement, aging, temperature, and pressure chemical exposure.
04 APPLICATIONS
Area using static seal exposed to process gases
(Chemical Vapor Deposition)
05 Structure and shape