NANOPURE ® 7870G offers excellent chemical resistance and is resistant to many types of chemicals. In addition, it is suitable for both static and dynamic processes due to its excellent mechanical properties and permanent compression recovery rate. NANOPURE ® 7870G can be used up to 220℃.

NANOPURE® 875HT is designed to have excellent resistance to fluorine-based plasma environments at high temperatures. In particular, it has excellent chemical resistance and low compression set in high-temperature processes, extending the life of sealing. NANOPURE® 875HT can be used up to 320℃.

NANOPURE® M208 is designed to minimize problems caused by particle generation with a low etch rate in highly corrosive environments caused by plasma. It also offers excellent thermal properties and physical strength, making it suitable for both static and dynamic processes. NANOPURE® M208 can be used up to 310℃.

NANOPURE® XUP is designed to minimize problems caused by particle generation with a low etch rate, especially in harsh plasma environments. In addition, it is suitable for both fixed and driving parts due to its excellent permanent compression recovery rate and mechanical properties. NANOPURE® XUP can be used up to 300℃.

NANOPURE® HX-8 is designed to minimize problems caused by particle generation with a low etch rate in highly corrosive environments caused by plasma. It also offers excellent thermal properties and physical strength, making it suitable for both static and dynamic processes. NANOPURE® HX-8 can be used up to 310℃.

NANOPURE® HX-10 is an ultra-pure perfluoroelastomer product designed without fillers, which minimizes the risk of process contamination and shows excellent plasma crack resistance in oxygen and fluorine-based plasma environments. In addition, it has excellent mechanical strength and low compression recovery rate. NANOPURE® HX-10 can be used up to 275℃.