product

FFKM & FKM
  • Home

  • product

    Physical Properties

    FFKM是指全氟化弹性体,比普通氟橡胶含有更多的氟。
    FFKM对温度较高、各种化学物质具有抗性,即使在等离子体存在的环境中也能耐受很长时间。 特别是特定等级的过氟橡胶最多可在327℃下连续使用,基于这些特点,在半导体、石油化学等需要Sealing的多种产业中得到应用。

    01 Molecular Structure

    分子结构

    FFKM & FKM Physical Properties

    FFKM & FKM Physical Properties

    02 MNE Products

    MNE
    Products

    03Applications

    应用领域

    Automotive

    Semiconductor

    Oil & Gas

    Chemical Processing
    Industry

    详细比较

    Contents 工序 Seal 温度 DuPontTM / Kalrez® GreeneTweedTM / Chemraz® MNETM NANOPURE®
    Plasma Processes HDP-CVD / PE-CVD 25 ~ 200℃ 9100 / 8085 XRZ 657 HX-8 XUP M208
    Etching 25 ~ 200℃
    Ashing / Stripping 25 ~ 250℃ HP9600 XUP HX-10
    Thermal Processes SA - CVD 25 ~ 250℃ 8085 XE38 I800W HP9600
    Metal-CVD, ALD, LP-CVD 25 ~ 300℃ 8900 / 9100 657 HX-5 HX-8
    Oxidation, Diffusion 150 ~ 300℃ 9800 / 8475 657 HX-5 875HT
    Lamp Anneal, RTP 150 ~ 300℃ 8475 E38 I800W
    Wet Processes Wafer Prep 25 ~ 125℃ 6375
    4079
      I800W 4080
    Etching 25~180℃
    Photolithography 25~125℃
    Stripping 25~125℃ 6375
    Copper Plationg 25~100℃
    Contents Color Service
    Temp.,℃
    Hardness,
    Shore A
    Tensile
    Stength, MPa
    Elongation, % 100%
    Modulus, MPa
    C/S 204℃ at 70hr
    (177℃ at 22hr), %
    Non Filler HX-10 275 69 19.5 184 3.1 16
    HX-8 310 74 11.0 250 3.9 16
    XUP 300 75 14.0 216 4.2 12
    M208 310 71 11.9 208 4.5 15
    With Filler HX-9 327 78 14.3 178 7.2 10
    HX-7 325 75 11.2 202 6.1 12
    875HT 320 75 10.0 220 4.2 12
    4080 280 78 17.7 140 11.4 20
    Copolymer 7575 220 75 15.1 210 5.3 28
    7870G 220 75 14.0 220 6.2 28
    Terpolymer EAO75S 260 74 21.6 230 5.4 16
    9020SP 260 70 18.2 290 2.1 20
    HPE
    (Tetrapolymer)
    9023SP 250 73 22.5 226 4.7 17.9
    UTC-3 250 68 20.0 280 2.6 20
    UTC-4 220 68 17.1 323 2.2 23
    PVMQ 102FVMQ 200 70 10.0 300 4.0 15
    • FFKM – non Filler
    • FFKM – with Filler
    • FKM – Copolymer
    • FKM – Terpolymer
    • HPE – Tetrapolymer
    • FVMQ

    NANOPURE® HX-10

    For Semiconductor Ash/Strip Application

    NANOPURE®HX-10是为了Ash/Strip工序的 透明产品。

    NANOPURE®HX-10是一种超纯全氟碳化物产品,无填充物设计,最大程度地降低了工艺污染的风险,在氧氟基等离子体环境中表现出良好的等离子体抗裂性能。 此外,机械强度好,永久压缩复原率低。 NANOPURE®HX-10最高可在275℃下使用。

    Features & Benefit

    • Exceptional plasma resistance in oxygen and fluorine environments
    • High purity, very low metallic ion content
    • Excellent compression set properties
    • Excellent resistance to dry process chemistry

    Suggested Applications

    • Gas inlet / outlet seals
    • Endpoint windows
    • Other static and low stress / low sealing force application

    Typical Physical Properties

    Color Transparent Amber
    Polymer Type Perfluoroelastomer
    Hardness1), Shore A 69
    Tensile Strength at Break2), Mpa 19.5
    Elongation at Break3), % 184
    100% Modulus4), Mpa 3.1
    Compression Set5), % -
    70 hours @ 204℃ 16
    Maximum Application Temperature, ℃ 275

    1) ASTM D1415 (ISO 48), 2) ASTM D412 (ISO 37), 3) ASTM D412 (ISO 37), 4) ASTM D412 (ISO 37), 5) ASTM D395 Method B : (ISO 815)